The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Apr. 11, 2016
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;

Inventors:

Kazuhiro Kobayashi, Nagano, JP;

Junji Sato, Nagano, JP;

Yasuhiko Kusama, Nagano, JP;

Assignee:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/4763 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/13 (2013.01); H01L 23/145 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01);
Abstract

A wiring substrate includes a first wiring substrate, a first insulation layer covering the first wiring layer, a second insulation layer stacked on the first insulation layer, and a cavity extending through the second insulation layer and exposing a portion of the upper surface of the first insulation layer. The cavity includes an opening, which is defined by an upper portion of a stepped inner wall surface of the second insulation layer, and a recess, which is defined by a lower portion of the stepped inner wall surface that contacts the upper surface of the first insulation layer. The recess is wider than the opening. An electronic component is mounted on the upper surface of the first insulation layer. The opening and the recess are filled with a third insulation layer that covers the electronic component and the second insulation layer.


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