The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Dec. 09, 2015
Applicant:
J-devices Corporation, Usuki-shi, Oita, JP;
Inventors:
Yoshihiko Ikemoto, Yokohama, JP;
Shigenori Sawachi, Yokohama, JP;
Fumihiko Taniguchi, Yokohama, JP;
Akio Katsumata, Yokohama, JP;
Assignee:
J-DEVICES CORPORATION, Usuki-shi, Oita, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 23/3128 (2013.01); H01L 23/5227 (2013.01); H01L 23/552 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 23/49816 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01);
Abstract
The present invention is to provide a semiconductor device in which the generation of the eddy current in a metal flat plate is reduced, and the Q value of the RF circuit of the semiconductor device is improved even using the metal flat plate as a support.