The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Oct. 18, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Manfred Engelhardt, Villach-Landskron, AT;
Edward Fuergut, Dasing, DE;
Hannes Eder, Villach-Landskron, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 23/28 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/28 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/76251 (2013.01); H01L 21/76254 (2013.01); H01L 21/76259 (2013.01); H01L 21/78 (2013.01); H01L 23/3185 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A method of forming a thinned encapsulated chip structure, wherein the method comprises providing a separation structure arranged within an electronic chip, encapsulating part of the electronic chip by an encapsulating structure, and thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.