The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
May. 29, 2015
Applicant:
Veeco Instruments, Inc., Plainview, NY (US);
Inventor:
Daewon Kwon, Whippany, NJ (US);
Assignee:
Veeco Instruments Inc., Plainview, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/956 (2006.01); H04N 5/225 (2006.01); H01L 21/67 (2006.01); G01B 11/06 (2006.01); G01B 11/00 (2006.01); C23C 16/458 (2006.01); C23C 16/52 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); C23C 16/4584 (2013.01); C23C 16/52 (2013.01); G01B 11/002 (2013.01); G01B 11/0608 (2013.01); H01L 21/67259 (2013.01);
Abstract
The surface topography of at least one wafer can be determined in-situ based on deflectometer measurements of surface tilt. The deflectometer is re-positioned by a scanning positioner to facilitate tilt mapping of the wafer surface for each of the at least one wafer. A surface height mapping engine is configured to generate a three-dimensional topographic mapping of the surface of each of the at least one wafer based on the mapping of the tilt.