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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9627231 B1

PDFFull Text
Date of Patent:
Apr. 18, 2017

Filed:

Aug. 30, 2013

Methods for bonding substrates

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kadthala Ramaya Narendrnath, San Jose, CA (US);

Gangadhar Sheelavant, Karnataka, IN;

Monika Agarwal, Fremont, CA (US);

Ashish Bhatnagar, Fremont, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:

Patterson + Sheridan, LLP

Primary Examiner:

Victor Chang

Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 3/20 (2006.01); H01L 21/67 (2006.01); B32B 7/14 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67005 (2013.01); B32B 7/14 (2013.01); H01L 21/67092 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01L 21/6835 (2013.01); H01L 21/68785 (2013.01); H01L 21/67109 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/27438 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/29012 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/29014 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29078 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83877 (2013.01); H01L 2224/98 (2013.01); H01L 2924/15151 (2013.01); Y10T 156/10 (2015.01); Y10T 279/23 (2015.01); Y10T 428/24851 (2015.01);
Abstract

Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly.

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