The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Jan. 04, 2016
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Denis Borisovich Malashevich, Zelenograd, RU;

Viacheslav Sergeyevich Kalashnikov, Microregion Firsanovka, RU;

Mikhail Yurievich Semenov, Zelenograd, RU;

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); G06F 17/50 (2006.01); H01L 27/092 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5072 (2013.01); H01L 27/0207 (2013.01); H01L 27/092 (2013.01); H01L 27/0922 (2013.01); H01L 29/0684 (2013.01); H01L 29/0688 (2013.01);
Abstract

A CMOS device comprises a substrate with a plurality of regions, the regions including an N-type region and a P-type region which meet each other in a PN-boundary, two or more P-type active regions embedded in the N-type region, and two or more N-type active regions embedded in the P-type region. The PN-boundary or a section of the PN-boundary is a chain of line segments. Any two adjoining line segments of the chain are angled relative to each other at their connecting point. The CMOS device can be designed using abutting standard cells. For each of two or more operating points, rise delays and fall delays associated with one or more clock cells are estimated. If the estimated rise delays and fall delays satisfy a given set of constraints, the layout of the CMOS device is accepted. Otherwise the layout is updated and a new analysis round is performed.


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