The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Sep. 27, 2013
Applicants:
Paul A. Nyhus, Portland, OR (US);
Eungnak Han, Beaverton, OR (US);
Swaminathan Sivakumar, Beaverton, OR (US);
Ernisse S. Putna, Portland, OR (US);
Inventors:
Paul A. Nyhus, Portland, OR (US);
Eungnak Han, Beaverton, OR (US);
Swaminathan Sivakumar, Beaverton, OR (US);
Ernisse S. Putna, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/027 (2006.01); G03F 7/039 (2006.01); H01L 21/033 (2006.01); H01L 21/3105 (2006.01); H01L 21/32 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0392 (2013.01); G03F 7/0002 (2013.01); H01L 21/0337 (2013.01); H01L 21/31058 (2013.01); H01L 21/32 (2013.01); H01L 21/76816 (2013.01);
Abstract
Self-aligned via and plug patterning for back end of line (BEOL) interconnects are described. In an example, a structure for directed self-assembly includes a substrate and a block co-polymer structure disposed above the substrate. The block co-polymer structure has a polystyrene (PS) component and a polymethyl methacrylate (PMMA) component. One of the PS component or the PMMA component is photosensitive.