The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Oct. 21, 2009
Applicants:

Tetsu Yamakawa, Kanagawa, JP;

Noriaki Oshima, Kanagawa, JP;

Takahiro Kawabata, Kanagawa, JP;

Tomoyuki Kinoshita, Kanagawa, JP;

Toshio Inase, Kanagawa, JP;

Inventors:

Tetsu Yamakawa, Kanagawa, JP;

Noriaki Oshima, Kanagawa, JP;

Takahiro Kawabata, Kanagawa, JP;

Tomoyuki Kinoshita, Kanagawa, JP;

Toshio Inase, Kanagawa, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C23C 18/08 (2006.01); B22F 9/24 (2006.01);
U.S. Cl.
CPC ...
C23C 18/08 (2013.01); B22F 9/24 (2013.01); B22F 2998/00 (2013.01); H01B 1/02 (2013.01); H01B 1/026 (2013.01);
Abstract

A composition that includes a high-valent compound of copper, silver or indium; a linear, branched or cyclic Calcohol; and a Group VIII metal catalyst forms a metal film of copper, silver or indium on a substrate when the composition is coated on the substrate and heated to reduce the high-valent compound. The composition may alternatively include metal particles of silver, copper or indium in which the surface layer of the particle includes a high-valent compound of copper, silver or indium. A metal film of copper, silver or indium may also be formed on a substrate by coating a substrate with the composition including the metal particles, and heating to reduce the high-valent compound in the same manner as above.


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