The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Nov. 11, 2013
Applicant:
GE Embedded Electronics Oy, Helsinki, FI;
Inventors:
Assignee:
GE Embedded Electronics Oy, Helsinki, FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/06 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H05K 3/20 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/064 (2013.01); H01L 21/4846 (2013.01); H01L 23/13 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H05K 1/183 (2013.01); H05K 1/187 (2013.01); H05K 1/188 (2013.01); H05K 3/303 (2013.01); H01L 23/5389 (2013.01); H01L 23/544 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/90 (2013.01); H01L 2223/54473 (2013.01); H01L 2224/16 (2013.01); H01L 2224/18 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/81121 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/83132 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15153 (2013.01); H05K 3/205 (2013.01); H05K 3/284 (2013.01); H05K 3/305 (2013.01); H05K 3/32 (2013.01); H05K 3/321 (2013.01); H05K 3/4069 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/0353 (2013.01); H05K 2203/063 (2013.01); H05K 2203/0723 (2013.01); Y10T 29/4913 (2015.01);
Abstract
A method for manufacturing a circuit-board structure wherein a conductor foil is provided on an insulating material layer, a resist layer is spread on the conductor foil and a recess formed in the conductor foil and insulating material layer. The resist layer is patterned to form a conductor-pattern having openings wherein conductor patterns may be grown. A component is attached to the conductor foil and conductor pattern and conductor material is removed which does not form part of a conductor pattern.