The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Jul. 15, 2014
Mpi Corporation, Zhubei, TW;
Wei-Cheng Ku, Zhubei, TW;
Jun-Liang Lai, Zhubei, TW;
Chun-Chung Huang, Taipei, TW;
Jing-Zhi Hung, Zhubei, TW;
Yung Nan Wu, Tainan, TW;
Chih-Hao Ho, Xinpu Township, TW;
MPI CORPORATION, Zhubei, TW;
Abstract
A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first conductive lands is respectively provided on each of the exposed portions. Each of the second conductive lands is provided on the exposed portion of the outermost substrate, wherein each of the substrates has a conductor pattern to be electrically connected to one of the first conductive lands and to one of the second conductive lands.