The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

May. 25, 2016
Applicant:

Tyco Electronics Corporation, Berwyn, PA (US);

Inventors:

Michael Joseph Vino, IV, Landisville, PA (US);

Alan Weir Bucher, Manheim, PA (US);

Craig Warren Hornung, Harrisburg, PA (US);

Assignee:

TE CONNECTIVITY CORPORATION, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/00 (2006.01); H01R 13/533 (2006.01); F28F 13/00 (2006.01); H05K 7/20 (2006.01); G02B 6/42 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01R 13/533 (2013.01); F28F 13/00 (2013.01); H05K 7/20445 (2013.01); G02B 6/4269 (2013.01); H01L 21/4882 (2013.01); H01L 23/367 (2013.01); H05K 7/20436 (2013.01); H05K 7/20472 (2013.01);
Abstract

Thermal-transfer assembly includes a first transfer module having a plurality of first projections. The first projections are spaced apart from one another to form corresponding gaps therebetween. The thermal-transfer assembly also includes a second transfer module having a plurality of second projections. The second projections are spaced apart from one another to form corresponding gaps therebetween. The first and second transfer modules interface with each other in a mated arrangement. The first and second projections project in opposite directions along a Z-axis and intimately engage one another to transfer thermal energy therebetween. The thermal-transfer assembly also includes an assembly clip coupled to and configured to engage each of the first and second transfer modules. The assembly clip prevents the first and second transfer modules from separating along the Z-axis and/or biases the first and second transfer modules away from each other along the Z-axis.


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