The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

May. 08, 2014
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventor:

Hideto Tamaso, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 29/16 (2006.01); H01L 23/544 (2006.01); H01L 29/66 (2006.01); H01L 29/04 (2006.01); H01L 21/66 (2006.01); H01L 29/40 (2006.01); H01L 21/00 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02529 (2013.01); H01L 21/0274 (2013.01); H01L 22/12 (2013.01); H01L 23/544 (2013.01); H01L 29/045 (2013.01); H01L 29/1608 (2013.01); H01L 29/401 (2013.01); H01L 29/66068 (2013.01); H01L 29/0623 (2013.01); H01L 29/7813 (2013.01); H01L 2223/54453 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method for manufacturing a silicon carbide semiconductor device includes the following steps. There is prepared a first silicon carbide layer having a first main surface and a second main surface. A first recess including a side portion and a bottom portion is formed in the first main surface of the first silicon carbide layer. A second silicon carbide layer is formed in contact with the first main surface, the side portion, and the bottom portion. An image of a second recess formed at a position facing the first recess of the fourth main surface is obtained. Alignment is performed based on the image of the second recess. The first main surface corresponds to a plane angled off relative to a {0001} plane. A ratio obtained by dividing a depth of the first recess by a thickness of the second silicon carbide layer is more than 0.2.


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