The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Jun. 27, 2013
Mitsubishi Materials Corporation, Tokyo, JP;
Sotaro Oi, Kitamoto, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A power-module substrate includes first and second sets of circuit-layer metal-plates, a first ceramic substrate, a metal member connecting the first and second sets of circuit-layer metal-plates through a hole formed in the first ceramic substrate, a second ceramic substrate, a heat-radiation-layer metal-plate, and an electric component attached to a top surface of one of the first set of circuit-layer metal-plates above the metal member and the through hole. The power-module substrate is configured to conduct heat from the electric component through the through hole via the metal member, along the second set of circuit-layer metal-plates, and to the heat-radiation-layer metal-plate.