The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Mar. 29, 2016
Winbond Electronics Corp., Taichung, TW;
Winbond Electronics Corp., Taichung, TW;
Abstract
A method of fabricating a memory device includes providing a substrate having a first region and a second region. A first dielectric layer is formed on the substrate in the first region. A conductive layer is formed on the substrate in the second region. A top surface of the conductive layer is lower than a top surface of the first dielectric layer. A second dielectric layer is formed on the substrate. A portion of the second dielectric layer and a portion of the conductive layer are removed to form a first opening in the conductive layer and the second dielectric layer in the second region. The first opening exposes a surface of the substrate. A portion of the substrate in the second region is removed to form a trench in the substrate in the second region. A third dielectric layer is formed in the trench and the first opening.