The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Aug. 07, 2015
Applicant:
Monolithic 3d Inc., San Jose, CA (US);
Inventors:
Zvi Or-Bach, San Jose, CA (US);
Brian Cronquist, San Jose, CA (US);
Deepak C. Sekar, San Jose, CA (US);
Zeev Wurman, Palo Alto, CA (US);
Israel Beinglass, Sunnyvale, CA (US);
Assignee:
Monolithic 3D Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 21/762 (2006.01); H01L 29/78 (2006.01); H01L 27/105 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01); H01L 27/088 (2006.01); G11C 8/16 (2006.01); H01L 21/768 (2006.01); H01L 21/822 (2006.01); H01L 21/8238 (2006.01); H01L 21/84 (2006.01); H01L 23/525 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 21/74 (2006.01); H01L 27/02 (2006.01); H01L 27/06 (2006.01); H01L 27/092 (2006.01); H01L 27/10 (2006.01); H01L 27/108 (2006.01); H01L 29/788 (2006.01); H01L 29/792 (2006.01); H01L 27/11 (2006.01); H01L 27/112 (2006.01); H01L 27/11526 (2017.01); H01L 27/11529 (2017.01); H01L 27/11551 (2017.01); H01L 27/11573 (2017.01); H01L 27/11578 (2017.01); H01L 27/118 (2006.01); H01L 27/12 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); G11C 8/16 (2013.01); H01L 21/743 (2013.01); H01L 21/76254 (2013.01); H01L 21/76898 (2013.01); H01L 21/8221 (2013.01); H01L 21/823828 (2013.01); H01L 21/84 (2013.01); H01L 23/481 (2013.01); H01L 23/5252 (2013.01); H01L 23/544 (2013.01); H01L 27/0207 (2013.01); H01L 27/0688 (2013.01); H01L 27/088 (2013.01); H01L 27/092 (2013.01); H01L 27/10 (2013.01); H01L 27/105 (2013.01); H01L 27/10802 (2013.01); H01L 27/10876 (2013.01); H01L 27/10894 (2013.01); H01L 27/10897 (2013.01); H01L 27/11 (2013.01); H01L 27/112 (2013.01); H01L 27/1108 (2013.01); H01L 27/11526 (2013.01); H01L 27/11529 (2013.01); H01L 27/11551 (2013.01); H01L 27/11573 (2013.01); H01L 27/11578 (2013.01); H01L 27/11807 (2013.01); H01L 27/11898 (2013.01); H01L 27/1203 (2013.01); H01L 29/4236 (2013.01); H01L 29/66272 (2013.01); H01L 29/66621 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01); H01L 29/66901 (2013.01); H01L 29/78 (2013.01); H01L 29/7841 (2013.01); H01L 29/7843 (2013.01); H01L 29/7881 (2013.01); H01L 29/792 (2013.01); H01L 23/3677 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 27/10873 (2013.01); H01L 27/11206 (2013.01); H01L 27/1214 (2013.01); H01L 27/1266 (2013.01); H01L 2221/68368 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83894 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06558 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01066 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12033 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30105 (2013.01);
Abstract
A 3D semiconductor device, including: a first layer including first transistors; a first interconnection layer interconnecting the first transistors and overlying the first layer; and a second layer including second transistors, where the second layer thickness is less than 2 microns and greater than 5 nm, where the second layer is overlying the first interconnection layer, and where the second layer includes dice lines formed by an etch step.
Quick Actions:
Or-Bach, Zvi. (2017). 3d semiconductor device having two layers of transistors (U.S. Patent No. 9613844). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9613844
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile