The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Jul. 29, 2015
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Cheng-Chi Tai, Taichung, TW;

Chun-Ju Tao, Yunlin County, TW;

Chung-Che Huang, Tainan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/283 (2006.01); H01L 21/3213 (2006.01); H01L 29/51 (2006.01); H01L 21/311 (2006.01); H01L 29/66 (2006.01); H01L 29/49 (2006.01); H01L 21/768 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32136 (2013.01); H01L 21/283 (2013.01); H01L 21/31144 (2013.01); H01L 21/76897 (2013.01); H01L 29/45 (2013.01); H01L 29/495 (2013.01); H01L 29/517 (2013.01); H01L 29/66477 (2013.01);
Abstract

A semiconductor process for treating a metal gate includes the following steps. A metal gate including a main conductive material on a substrate is provided. A H/Nplasma treatment process is performed to reduce the main conductive material.


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