The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Dec. 30, 2011
Applicant:
Ioan Sauciuc, Phoenix, AZ (US);
Inventor:
Ioan Sauciuc, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); F28F 13/06 (2006.01); F28F 23/00 (2006.01); F28D 15/02 (2006.01); H01L 23/473 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
F28D 15/04 (2013.01); F28D 15/0275 (2013.01); F28F 13/06 (2013.01); F28F 23/00 (2013.01); H01L 23/467 (2013.01); H01L 23/4735 (2013.01); F28F 2260/02 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/1461 (2013.01);
Abstract
Various embodiments of microelectronic package cooling assemblies are described. Those embodiments include a cooling assembly comprising an array of vertically separated micro channels coupled to a heat spreader, wherein the heat spreader is finless, and wherein each inlet micro channel has two adjacent outlet micro channels. A distance between individual vertically separated micro channels comprises less than about 20 microns, and a heat pipe is embedded in the heat spreader.