The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Apr. 07, 2015
Applicant:

Shengyi Technology Co., Ltd., Dongguan, CN;

Inventors:

Jiang You, Dongguan, CN;

Tianhui Huang, Dongguan, CN;

Zhongqiang Yang, Dongguan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); C08K 5/357 (2006.01); C08J 5/24 (2006.01); C08K 3/36 (2006.01); C08G 59/40 (2006.01); C08K 5/35 (2006.01);
U.S. Cl.
CPC ...
C08K 5/357 (2013.01); C08G 59/4071 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08K 5/35 (2013.01); C08J 2363/00 (2013.01);
Abstract

The present invention relates to a halogen-free thermosetting resin composition and also a prepreg and a laminate for printed circuits prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better processability, and can fulfill halogen-free flame retardancy and achieve UL94 V-0 grade.


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