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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9609754 B1

PDFFull Text
Date of Patent:
Mar. 28, 2017

Filed:

Jan. 22, 2014

Package for mounting electronic element, electronic device, and imaging module

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Akihiko Funahashi, Kyoto, JP;

Kanae Horiuchi, Kyoto, JP;

Yousuke Moriyama, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Gary C Vieaux

Int. Cl.
CPC ...
H04N 5/225 (2006.01); H05K 1/18 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 27/146 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 21/4857 (2013.01); H01L 23/13 (2013.01); H01L 23/49827 (2013.01); H01L 27/14618 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/2257 (2013.01); H05K 1/0284 (2013.01); H05K 1/111 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H05K 2201/10287 (2013.01);
Abstract

There are provided a package for mounting an electronic element which can be reduced in size and an electronic device. A package for mounting an electronic element includes an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section so as to be electrically connected to the electrode pad; and a wiring conductor embedded within the frame section so as to be electrically connected to the first wall conductor. Consequently, the package for mounting an electronic element can be reduced in size, and is capable of suppressing electrical short-circuiting between the wiring conductor and an electronic element and of suppressing occurrence of a crack in the insulating base.

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