The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Feb. 05, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Can Bayram, Champaign, IL (US);

Cheng-Wei Cheng, White Plains, NY (US);

Tayfun Gokmen, Briarcliff Manor, NY (US);

Ning Li, White Plains, NY (US);

John A. Ott, Greenwood Lake, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Kuen-Ting Shiu, Yorktown Heights, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 33/00 (2010.01); H01L 33/12 (2010.01); H01L 33/32 (2010.01); H01L 33/22 (2010.01); H01L 33/18 (2010.01); H01L 33/36 (2010.01);
U.S. Cl.
CPC ...
H01L 33/007 (2013.01); H01L 33/12 (2013.01); H01L 33/18 (2013.01); H01L 33/22 (2013.01); H01L 33/32 (2013.01); H01L 33/36 (2013.01); H01L 2933/0016 (2013.01);
Abstract

After forming patterned dielectric material structures over a (100) silicon substrate, portions of the silicon substrate that are not covered by the patterned dielectric material structures are removed to provide a plurality of openings within the silicon substrate. Each opening exposes a surface of the silicon substrate having a (111) crystalline plane. A buffer layer is then formed on the exposed surfaces of the patterned dielectric material structures and the silicon substrate. A dual phase Group III nitride structure including a cubic phase region is formed filling a space between each neighboring pair of the patterned dielectric material structures and one of the openings located beneath the space. Finally, at least one Group III nitride layer is epitaxially deposited over the cubic phase region of the dual phase Group III nitride structure.


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