The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Oct. 17, 2014
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Helmut Hagleitner, Zebulon, NC (US);

Fabian Radulescu, Chapel Hill, NC (US);

Saptharishi Sriram, Cary, NC (US);

Daniel Etter, Fuquay-Varina, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 29/812 (2006.01); H01L 29/20 (2006.01); H01L 29/417 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 29/402 (2013.01); H01L 29/4958 (2013.01); H01L 29/66068 (2013.01); H01L 29/66863 (2013.01); H01L 29/7786 (2013.01); H01L 29/8128 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/41766 (2013.01);
Abstract

A transistor device includes a semiconductor body, a spacer layer, and a field plate. The spacer layer is over at least a portion of a surface of the semiconductor body. The field plate is over at least a portion of the spacer layer, and includes a first current carrying layer, a refractory metal interposer layer over the first current carrying layer, and a second current carrying layer over the refractory metal interposer layer. By including the refractory metal interposer layer between the first current carrying layer and the second current carrying layer, the electromigration of metals in the field plate is significantly reduced. Since electromigration of metals in the field plate is a common cause of transistor device failures, reducing the electromigration of metals in the field plate improves the reliability and lifetime of the transistor device.


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