The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Mar. 03, 2014
Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;
Kenji Matsuda, Nirasaki, JP;
Dai Shinozaki, Nirasaki, JP;
Yuichi Makita, Tsukuba, JP;
Hitoshi Kubo, Tsukuba, JP;
Yusuke Ohshima, Tsukuba, JP;
Hidekazu Matsuda, Tsukuba, JP;
Junichi Taniuchi, Tsukuba, JP;
TANAKA KIKINZOKU KOGYO K.K., Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor chip which can be a heat-generating semiconductor chip or a semiconductor relay substrate in which an integrated circuit or wiring is built in. A sintered-silver-coated film is adhered on a surface layer part of the semiconductor substrate, interposed by a silicon oxide film. A heat-dissipating fin (heat sink), which may be copper or aluminum, is bonded on the sintered-silver-coated film, interposed by an adhesive layer.