The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Jul. 14, 2015
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Lianjun Liu, Chandler, AZ (US);

Philippe Lance, Toulouse, FR;

David J. Monk, Mesa, AZ (US);

Babak A. Taheri, Phoenix, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 21/66 (2006.01); G01R 1/073 (2006.01); G01R 31/302 (2006.01);
U.S. Cl.
CPC ...
H01L 22/30 (2013.01); G01R 1/07342 (2013.01); G01R 31/2884 (2013.01); G01R 31/3025 (2013.01); H01L 22/10 (2013.01); G01R 31/2891 (2013.01);
Abstract

A system for programming integrated circuit (IC) dies formed on a wafer includes an optical transmitter that outputs a digital test program as an optical signal. At least one optical sensor (e.g., photodiode) is formed with the IC dies on the wafer. The optical sensor detects and receives the optical signal. A processor formed on the wafer converts the optical signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the IC dies. The optical transmitter does not physically contact the dies, but can flood an entire surface of the wafer with the optical signal so that all of the IC dies are concurrently programmed with the digital test program.


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