The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Jan. 16, 2015
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventors:
Xing Hua Zhang, Singapore, SG;
Chi-Fa Ku, Kaohsiung, TW;
Hong Liao, Singapore, SG;
Ye Chao Li, Singapore, SG;
Hui Yang, Singapore, SG;
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 23/58 (2006.01); H01L 21/66 (2006.01); H01L 23/528 (2006.01); H01L 21/8238 (2006.01); H01L 27/02 (2006.01); H01L 23/10 (2006.01); H01L 27/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5081 (2013.01); H01L 22/34 (2013.01); H01L 23/58 (2013.01); H01L 21/823871 (2013.01); H01L 23/10 (2013.01); H01L 23/528 (2013.01); H01L 23/562 (2013.01); H01L 27/0266 (2013.01); H01L 27/0629 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor monitoring device includes a substrate, a die seal ring formed on the substrate, a deep n-typed well formed in the substrate under the die seal ring, and a monitoring device electrically connected to the die seal ring. The monitoring device is formed in a scribe line region defined on the substrate. A width of the deep n-typed well is larger than a width of the die seal ring.