The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Nov. 29, 2011
Mark J. Gallina, Hillsboro, OR (US);
Jason B. Chesser, Beaverton, OR (US);
Mike G. Macgregor, Portland, OR (US);
Mark J. Luckeroth, Portland, OR (US);
Brian S. Jarrett, Hillsboro, OR (US);
Thu Huynh, Hillsboro, OR (US);
Eric D. Mcafee, Portland, OR (US);
Barrett M. Faneuf, Beaverton, OR (US);
Michelle Goeppinger, Portland, OR (US);
Mark J. Gallina, Hillsboro, OR (US);
Jason B. Chesser, Beaverton, OR (US);
Mike G. Macgregor, Portland, OR (US);
Mark J. Luckeroth, Portland, OR (US);
Brian S. Jarrett, Hillsboro, OR (US);
Thu Huynh, Hillsboro, OR (US);
Eric D. Mcafee, Portland, OR (US);
Barrett M. Faneuf, Beaverton, OR (US);
Michelle Goeppinger, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.