The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Nov. 21, 2012
Applicant:

Scivax Corporation, Kanagawa, JP;

Inventors:

Hirosuke Kawaguchi, Tokyo, JP;

Satoru Tanaka, Tokyo, JP;

Assignee:

SCIVAX CORPORATION, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/00 (2006.01); G03F 7/00 (2006.01); B29C 59/02 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 59/02 (2013.01); B29C 59/022 (2013.01); H01L 21/565 (2013.01); B29C 2059/023 (2013.01); B29C 2791/006 (2013.01);
Abstract

An imprinting device to transfer the mold pattern on a die to a molding target includes a casing forming a pressure-adjusting chamber, a stage supporting the die and the molding target, a frame encircling a circumference of the stage, first moving means moving the casing and the stage in a direction coming close to each other or becoming distant from each other, second moving means moving the casing and the frame in a direction coming close to each other or becoming distant from each other, pressure-adjusting means that adjusts the pressure of a fluid in the pressure-adjusting chamber, and decompression means which decompresses a decompression chamber formed by the stage, a frame, and the die or the molding target, and which eliminates a fluid present between the die and the molding target.


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