The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Oct. 26, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Joshua D Heppner, Chandler, AZ (US);

Sriram Srinivasan, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 13/24 (2006.01); G01R 1/04 (2006.01); G06F 1/16 (2006.01); H01R 43/20 (2006.01); H05K 1/18 (2006.01); G01R 1/067 (2006.01);
U.S. Cl.
CPC ...
H01R 12/7076 (2013.01); G01R 1/0433 (2013.01); G01R 1/0466 (2013.01); G06F 1/1613 (2013.01); H01R 12/714 (2013.01); H01R 12/716 (2013.01); H01R 13/2471 (2013.01); H01R 43/205 (2013.01); H05K 1/181 (2013.01); G01R 1/06727 (2013.01); G01R 1/06733 (2013.01); Y10T 29/49204 (2015.01);
Abstract

An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.


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