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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9601706 B1

PDFFull Text
Date of Patent:
Mar. 21, 2017

Filed:

Apr. 17, 2015

Resin composition for forming protective film, protective film, pattern forming method, method for manufacturing electronic device, and electronic device

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Yu Iwai, Shizuoka, JP;

Atsushi Nakamura, Shizuoka, JP;

Yoshitaka Kamochi, Shizuoka, JP;

Masafumi Yoshida, Shizuoka, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
G03F 7/11 (2006.01); H01L 51/00 (2006.01); H01L 21/02 (2006.01); G03F 7/027 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/32 (2006.01); C09D 101/00 (2006.01); C09D 105/00 (2006.01); G03F 7/20 (2006.01); H01L 51/10 (2006.01); H01L 51/44 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0093 (2013.01); C09D 101/00 (2013.01); C09D 105/00 (2013.01); G03F 7/027 (2013.01); G03F 7/0388 (2013.01); G03F 7/0392 (2013.01); G03F 7/11 (2013.01); G03F 7/20 (2013.01); G03F 7/325 (2013.01); H01L 21/02118 (2013.01); H01L 51/004 (2013.01); H01L 51/107 (2013.01); H01L 51/448 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01);
Abstract

There is provided a resin composition for use in formation of a protective film to protect a substrate or a film formed on the substrate, from a developer containing an organic solvent to be used for development in pattern formation, and which contains two or more kinds of resins in which their main chain structures having a hydroxyl group are different, and contains water, a pattern forming method using the resin composition, and layered products comprising a substrate, an organic semiconductor film on the substrate, and a protective film comprising two or more kinds of resins in which their main chain structures having a hydroxyl group are different, on the organic semiconductor film.

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