The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Feb. 13, 2007
Hao-yi Tsai, Hsin-Chu, TW;
Shih-hsun Hsu, Hsin-Chu, TW;
Shih-cheng Chang, Hsin-Chu, TW;
Shang-yun Hou, Jubei, TW;
Hsien-wei Chen, Sinying, TW;
Chia-lun Tsai, Hsin-Chu, TW;
Benson Liu, Taipei, TW;
Shin-puu Jeng, Hsin-Chu, TW;
Anbiarshy Wu, Chiayi, TW;
Hao-Yi Tsai, Hsin-Chu, TW;
Shih-Hsun Hsu, Hsin-Chu, TW;
Shih-Cheng Chang, Hsin-Chu, TW;
Shang-Yun Hou, Jubei, TW;
Hsien-Wei Chen, Sinying, TW;
Chia-Lun Tsai, Hsin-Chu, TW;
Benson Liu, Taipei, TW;
Shin-Puu Jeng, Hsin-Chu, TW;
Anbiarshy Wu, Chiayi, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A semiconductor structure includes a daisy chain adjacent to an edge of a semiconductor chip. The daisy chain includes a plurality of horizontal metal lines distributed in a plurality of metallization layers, wherein the horizontal metal lines are serially connected; a plurality of connecting pads in a same layer and electrically connecting the horizontal metal lines, wherein the connecting pads are physically separated from each other; and a plurality of vertical metal lines, each connecting one of the connecting pads to one of the horizontal metal lines, wherein one of the plurality of connecting pads is connected to one of the plurality of horizontal metal lines by only one of the plurality of vertical metal lines; and a seal ring adjacent and electrically disconnected from the daisy chain.