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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9601376 B1

PDFFull Text
Date of Patent:
Mar. 21, 2017

Filed:

Dec. 07, 2015

Semiconductor device and method of manufacturing a semiconductor device having a glass piece and a single-crystalline semiconductor portion

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Alexander Breymesser, Villach, AT;

Andre Brockmeier, Villach, AT;

Francisco Javier Santos Rodriguez, Villach, AT;

Hans-Joachim Schulze, Taufkirchen, DE;

Carsten von Koblinski, Bodensdorf, AT;

Gerhard Schmidt, Wernberg, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Angel Roman

Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 21/20 (2006.01); H01L 23/00 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/861 (2006.01); H01L 21/56 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/2007 (2013.01); H01L 23/3178 (2013.01); H01L 23/564 (2013.01); H01L 29/7393 (2013.01); H01L 29/78 (2013.01); H01L 29/861 (2013.01); H01L 21/56 (2013.01); H01L 21/76224 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device includes a glass piece and an active semiconductor element formed in a single-crystalline semiconductor portion. The single-crystalline semiconductor portion has a working surface, a rear side surface opposite to the working surface and an edge surface connecting the working and rear side surfaces. The glass piece has a portion extending along and in direct contact with the edge surface of the single-crystalline semiconductor portion.

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