The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Jul. 14, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
I-Hsiung Huang, Hsinchu County, TW;
Heng-Hsin Liu, New Taipei, TW;
Heng-Jen Lee, Baoshan Township, TW;
Chin-Hsiang Lin, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0201 (2013.01); H01L 21/6835 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68381 (2013.01);
Abstract
A method including bonding a process wafer having integrated circuits and a carrier wafer having at least one alignment mark to form a wafer assembly. The method further includes aligning the wafer assembly using the at least one alignment mark of the carrier wafer.