The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Aug. 25, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Zhaoqing Chen, Poughkeepsie, NY (US);

Matteo Cocchini, Long Island City, NY (US);

Rohan U. Mandrekar, Sunnyvale, CA (US);

Tingdong Zhou, Austin, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5072 (2013.01); H05K 3/0005 (2013.01); G06F 17/5077 (2013.01); G06F 17/5081 (2013.01);
Abstract

One aspect is a method that includes identifying, by a power via placement tool executing on a processor of a circuit design system, a source and a sink of a voltage domain of a multi-layer circuit board based on a design file defining a layout of the multi-layer circuit board. A number of power vias to support a maximum current demand from the source to the sink is determined. Positions of a plurality of the power vias are determined at locations of the multi-layer circuit board forming paths through the power vias between the source and the sink and having a substantially equal total path length through each total path defined between the source and the sink through at least one of the power vias. The design file is modified to include the power vias at the positions.


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