The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Mar. 14, 2013
Applicant:
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Inventors:
Nagarajan Jayaraju, Framingham, MA (US);
Elie H. Najjar, Norwood, MA (US);
Leon R. Barstad, Raynham, MA (US);
Assignee:
Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/34 (2006.01); C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 5/10 (2006.01); H05K 3/42 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
C25D 5/34 (2013.01); C25D 3/38 (2013.01); C25D 5/02 (2013.01); C25D 5/022 (2013.01); C25D 5/10 (2013.01); H05K 3/423 (2013.01); C23C 18/1653 (2013.01);
Abstract
The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers.