The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Nov. 26, 2015
Chung-ping Lai, Zhubei, TW;
Kuo-hsin Chang, Dalin Township, Chiayi County, TW;
Jia-cing Chen, Tainan, TW;
Chung-Ping Lai, Zhubei, TW;
Kuo-Hsin Chang, Dalin Township, Chiayi County, TW;
Jia-Cing Chen, Tainan, TW;
Other;
Abstract
A hexagonal boron nitride heat dissipation structure includes a plurality of electronic components, plural thermally conductive buffer layers, and an electronic conductive heat dissipation element. Each electronic component is configured to generate heat, each thermally conductive buffer layer is made of hBN that has thermal conductivity range from 10 to 40 W/mK. Such structure can completely overcome the issue of short circuit of electronic devices. The cooling of modern electronic devices, which has limited space for cooling, can be improved by this simple structure that takes full advantage of hBN and other heat dissipation materials.