The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Feb. 11, 2015
Applicant:

Mpi Corporation, Zhubei, TW;

Inventors:

Wei-Cheng Ku, Zhubei, TW;

Jun-Liang Lai, Zhubei, TW;

Chih-Hao Ho, Zhubei, TW;

Assignee:

MPI CORPORATION, Zhubei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/426 (2013.01); H05K 1/0298 (2013.01); H05K 1/111 (2013.01); H05K 1/114 (2013.01); H05K 1/0393 (2013.01); H05K 3/421 (2013.01); H05K 3/429 (2013.01); H05K 2201/09545 (2013.01); H05K 2203/0369 (2013.01); H05K 2203/1461 (2013.01);
Abstract

A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.


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