The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Feb. 23, 2015
Applicants:

Nitto Optical Co., Ltd., Tokyo, JP;

Solartes Lab., Ltd., Kanagawa, JP;

Yoko Terashima, Kanagawa, JP;

Inventors:

Kazutaka Terashima, Kanagawa, JP;

Suzuka Nishimura, Kanagawa, JP;

Muneyuki Hirai, Kanagawa, JP;

Assignees:

NITTO OPTICAL CO., LTD., Tokyo, JP;

SOLARTES Lab, Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 33/16 (2010.01); H01L 21/02 (2006.01); C23C 16/30 (2006.01); H01L 33/06 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0025 (2013.01); C23C 16/303 (2013.01); H01L 21/0251 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02461 (2013.01); H01L 21/02491 (2013.01); H01L 21/02505 (2013.01); H01L 33/007 (2013.01); H01L 33/0066 (2013.01); H01L 33/0075 (2013.01); H01L 33/0079 (2013.01); H01L 33/06 (2013.01); H01L 33/16 (2013.01); H01L 33/32 (2013.01);
Abstract

A method for producing a GaN-based crystal includes forming a Zinc-blend type BP crystal layer on a Si substrate; forming an In-containing layer, on the BP crystal layer, with such a thickness as to keep the Zinc-blend type structure; and forming a Zinc-blend type GaN-based crystal layer on the In-containing layer. The In-containing layer is a metallic In layer having a thickness of 4 atom layers or less, an InGaN layer having a thickness of 2 nm or less, an InAl mixture layer having a thickness of 4 atom layers or less and containing Al at 10% or less, or an AlInGaN layer having a thickness of 2 nm or less and containing Al at 10% or less.


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