The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Jul. 23, 2014
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Atsushi Nakamura, Nagano, JP;

Tsukasa Nakanishi, Nagano, JP;

Yoichi Sasada, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 41/046 (2013.01); H01F 5/00 (2013.01); H01F 17/0013 (2013.01); H01F 2017/0066 (2013.01); Y10T 29/49071 (2015.01);
Abstract

A coil substrate includes a substrate, a coil-shaped wiring provided on one surface of the substrate, the coil-shaped wiring including adjacent parts provided adjacent to each other, and an insulating layer formed between the adjacent parts of the coil-shaped wiring. The coil-shaped wiring includes a first wiring, and a second wiring that is layered on the first wiring and has a thickness greater than a thickness of the first wiring. A space is provided between a side surface of the first wiring and the insulating layer. The second wiring fills the space and covers the first wiring. Both side surfaces of the second wiring contact the insulating layer.


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