The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Jul. 22, 2014
Applicant:
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Hyeon-jin Shin, Suwon-si, KR;
Seong-jun Park, Seoul, KR;
Jae-ho Lee, Seoul, KR;
Seong-Jun Jeong, Ulsan, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01B 1/08 (2006.01); C23C 14/08 (2006.01); C23C 14/02 (2006.01); C23C 16/02 (2006.01); C23C 16/40 (2006.01);
U.S. Cl.
CPC ...
H01B 1/08 (2013.01); C23C 14/025 (2013.01); C23C 14/08 (2013.01); C23C 16/0281 (2013.01); C23C 16/40 (2013.01); Y10T 428/265 (2015.01);
Abstract
A thin film structure includes a metal seed layer, and a method of forming an oxide thin film on a conductive substrate by using the metal seed layer is disclosed. The thin film structure includes a transparent conductive substrate, a metal seed layer that is deposited on the transparent conductive substrate, and a metal oxide layer that is deposited on the metal seed layer.