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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9592930 B1

PDFFull Text
Date of Patent:
Mar. 14, 2017

Filed:

Dec. 02, 2014

Methods and apparatus for large diameter wafer handling

Applicant:

Entegris, Inc., Billerica, MA (US);

Inventors:

Barry Gregerson, Deephaven, MN (US);

Michael S. Adams, New Prague, MN (US);

Jason T. Steffens, Shakopee, MN (US);

Assignee:

Entegris, Inc., Billerica, MA (US);

Attorney:

Entegris, Inc.

Primary Examiner:

Steven A Reynolds

Int. Cl.
CPC ...
H01L 21/673 (2006.01); B65D 25/10 (2006.01); H01L 21/677 (2006.01); B65D 25/28 (2006.01); B65D 43/02 (2006.01); B65D 85/00 (2006.01);
U.S. Cl.
CPC ...
B65D 25/103 (2013.01); B65D 25/28 (2013.01); B65D 43/02 (2013.01); B65D 85/70 (2013.01); H01L 21/6732 (2013.01); H01L 21/67369 (2013.01); H01L 21/67383 (2013.01); H01L 21/67386 (2013.01); H01L 21/67763 (2013.01);
Abstract

A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.

Find Patent Forward Citations

Gregerson, Barry. (2017). Methods and apparatus for large diameter wafer handling (U.S. Patent No. 9592930). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9592930

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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