The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Jan. 20, 2014
Applicant:
Lg Siltron Inc., Gyeongsangbuk-do, KR;
Inventor:
Dae-Hoon Kim, Ulsan, KR;
Assignee:
LG SILTRON INC., Gyeongsangbuk-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/08 (2012.01); H01L 21/67 (2006.01); B24B 37/16 (2012.01);
U.S. Cl.
CPC ...
B24B 37/08 (2013.01); B24B 37/16 (2013.01); H01L 21/67092 (2013.01);
Abstract
An embodiment of the present invention provides a surface plate provided at a wafer double-side grinding device for grinding a wafer. The surface plate includes a plurality of first surface plate grooves formed in a first direction, and a plurality of second surface plate grooves formed in a second direction different from the first direction. The first surface plate grooves and the second surface plate grooves have first and second surface plate groove portions arranged therein, the first and second surface plate groove portions having steps formed in a direction toward the center or an outer periphery of a lower surface plate.