The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Apr. 07, 2014
Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;
National Chiao-tung University, Hsinchu, TW;
National Chiao-Tung University, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;
Abstract
A semiconductor device and methods of formation are provided. The semiconductor device includes a first metal alloy over a first active region of a fin and a second metal alloy over a second active region of the fin. A conductive layer is over a channel region of the fin. A semiconductive layer is over the conductive layer. The conductive layer over the channel region suppresses current leakage and the semiconductive layer over the conductive layer reduces electro flux from a source to a drain, as compared to a channel region that does not have such a conductive layer or a semiconductive layer over a conductive layer. The semiconductor device having the first metal alloy as at least one of the source or drain requires a lower activation temperature than a semiconductor device that does not have a metal alloy as a source or a drain.