The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Apr. 08, 2014
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Sirish K. Reddy, Hillsboro, OR (US);

Chunhai Ji, Portland, OR (US);

Xinyi Chen, Tualatin, OR (US);

Pramod Subramonium, Beaverton, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/033 (2006.01); C23C 16/505 (2006.01); C23C 16/515 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0332 (2013.01); C23C 16/505 (2013.01); C23C 16/515 (2013.01); H01L 21/02115 (2013.01); H01L 21/02274 (2013.01);
Abstract

Methods of forming high etch selectivity, low stress ashable hard masks using plasma enhanced chemical vapor deposition are provided. In certain embodiments, the methods involve pulsing low frequency radio frequency power while keeping high frequency radio frequency power constant during deposition of the ashable hard mask using a dual radio frequency plasma source. According to various embodiments, the low frequency radio frequency power can be pulsed between non-zero levels or by switching the power on and off. The resulting deposited highly selective ashable hard mask may have decreased stress due to one or more factors including decreased ion and atom impinging on the ashable hard mask and lower levels of hydrogen trapped in the ashable hard mask.


Find Patent Forward Citations

Loading…