The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Oct. 16, 2015
Applicant:
Foxconn Interconnect Technology Limited, Grand Cayman, KY;
Inventors:
Chun-Yi Chang, New Taipei, TW;
Jia-Hau Liu, New Taipei, TW;
Assignee:
FOXCONN INTERCONNECT TECHNOLOGY LIMITED, Grand Cayman, KY;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G02B 6/428 (2013.01); G02B 6/4206 (2013.01); H05K 1/0209 (2013.01); H05K 1/0243 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10545 (2013.01); H05K 2203/167 (2013.01);
Abstract
An optoelectronic assembly includes a printed circuit board (PCB) defining opposite upper and lower surfaces, and equipped, on the upper surface, with an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, a lens module located on the side of the lower surface and communicating with the active component through via holes in the PCB, and a fiber assembly located in the lens module to be optically coupled to the active component via said lens module.