The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Apr. 14, 2015
Applicant:
Novellus Systems, Inc., Fremont, CA (US);
Inventors:
Manish Ranjan, Tualatin, OR (US);
Shantinath Ghongadi, Tigard, OR (US);
Frederick Dean Wilmot, Gladstone, OR (US);
Douglas Hill, Tualatin, OR (US);
Bryan L. Buckalew, Tualatin, OR (US);
Assignee:
Novellus Systems, Inc., Fremont, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/06 (2006.01); C25D 7/12 (2006.01); C25D 5/00 (2006.01); C25D 17/00 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
C25D 17/06 (2013.01); C25D 5/00 (2013.01); C25D 7/12 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); H01L 21/2885 (2013.01);
Abstract
Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.
Ranjan, Manish. (2017). Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath (U.S. Patent No. 9587322). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9587322
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile