The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Mar. 25, 2015
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Jeffrey P. Gambino, Portland, OR (US);
Richard S. Graf, Gray, ME (US);
Sudeep Mandal, Bangalore, IN;
David J. Russell, Owego, NY (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/00 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0094 (2013.01); H01L 21/486 (2013.01); H01L 21/76877 (2013.01); H01L 23/3731 (2013.01); H01L 23/3732 (2013.01); H01L 23/3738 (2013.01); H05K 1/0201 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H01L 2021/60007 (2013.01);
Abstract
The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having thermally conductive vias in addition to electrically conductive vias. The thermally conductive vias help dissipate heat from one or more IC chips, through the glass interposer, into an organic carrying, and then, into an underlying substrate where it can be dissipated.