The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Aug. 16, 2012
Applicants:
Hua Dong, Shrewsbury, MA (US);
Robert K. Barr, Shrewsbury, MA (US);
Inventors:
Hua Dong, Shrewsbury, MA (US);
Robert K. Barr, Shrewsbury, MA (US);
Assignee:
Sun Chemical Corporation, Parsippany, NJ (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); H01L 31/18 (2006.01); H01L 21/28 (2006.01); H01L 21/027 (2006.01); H01L 21/47 (2006.01); H01L 21/3115 (2006.01); H01L 21/02 (2006.01); C08L 93/04 (2006.01); C09D 11/08 (2006.01); C09D 11/34 (2014.01);
U.S. Cl.
CPC ...
H01L 31/1804 (2013.01); C08L 93/04 (2013.01); C09D 11/08 (2013.01); C09D 11/34 (2013.01); H01L 21/0273 (2013.01); H01L 21/02118 (2013.01); H01L 21/2822 (2013.01); H01L 21/31155 (2013.01); H01L 21/47 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract
The methods involve selectively depositing a resist containing a solid hydrogenated rosin resin and a liquid hydrogenated rosin resin ester as a mixture on a semiconductor followed by etching uncoated portions of the semiconductor and simultaneously inhibiting undercutting of the resist. The etched portions may then be metallized to form current tracks.