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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9583407 B1

PDFFull Text
Date of Patent:
Feb. 28, 2017

Filed:

Nov. 30, 2015

Semiconductor device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Hiroshi Yoshida, Tokyo, JP;

Yoshitaka Otsubo, Tokyo, JP;

Hidetoshi Ishibashi, Tokyo, JP;

Kenta Nakahara, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Chuong A Luu

Assistant Examiner:

Rodolfo D Fortich

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/053 (2006.01); H01L 23/10 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/373 (2006.01); H01L 23/057 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/13 (2013.01); H01L 23/3142 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/49861 (2013.01); H01L 24/83 (2013.01); H01L 23/057 (2013.01); H01L 23/293 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 2224/291 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83385 (2013.01);
Abstract

A first conductor layer is provided on a first surface of an insulating plate, and has a first volume. A second conductor layer is provided on a second surface of the insulating plate, and has a second volume. A third conductor layer is provided on a second surface of the insulating plate, and has a second volume. The third conductor layer has a mounting region thicker than the second conductor layer. The sum of the second and third volumes is greater than or equal to 70% and smaller than or equal to 130% of the first volume. A semiconductor chip is provided on the mounting region. A sealing part is formed of an insulator, and seals the semiconductor chip within a case.

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