The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Apr. 30, 2013
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Ping Mei, Palo Alto, CA (US);

Carl A. Taussig, Palo Alto, CA (US);

Marcia Almanza-Workman, Palo Alto, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/768 (2006.01); G06F 3/044 (2006.01); H01L 23/482 (2006.01); H01L 21/3213 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76886 (2013.01); G06F 3/044 (2013.01); H01L 21/32139 (2013.01); H01L 23/4821 (2013.01); H01L 23/528 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Circuit fabrication uses a multilevel mask to pattern a first conductor layer of a multilayer circuit. The first conductor patterning is to provide electrical isolation between the first conductor layer and a second conductor layer that one of overlies the multilevel mask and underlies the multilevel mask. With the second conductor layer overlying the multilevel mask, the electrical isolation is provided by undercutting the multilevel mask. Alternatively, with the second conductor underlying the multilevel mask, the first conductor includes a bridged gapped conductor and the electrical isolation may be provided by both the bridged gapped conductor and an insulating layer between the second conductor layer and the first conductor layer.


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