The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Feb. 04, 2015
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Martin Plihal, Pleasanton, CA (US);
Vidyasagar Anantha, Hyderabad, IN;
Assignee:
KLA-Tencor Corp., Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2006.01); G01N 21/95 (2006.01); G01N 21/956 (2006.01); G06K 9/52 (2006.01); G01N 21/88 (2006.01); G06K 9/62 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G01N 21/8851 (2013.01); G01N 21/9501 (2013.01); G01N 21/956 (2013.01); G06K 9/52 (2013.01); G06K 9/6255 (2013.01); G06T 7/001 (2013.01); G06T 7/004 (2013.01); G01N 2021/8854 (2013.01); G06K 9/00 (2013.01); G06T 2207/30148 (2013.01);
Abstract
Methods and systems for generating a defect sample for a wafer are provided. One method includes separating defects detected on a wafer into bins having diversity in values of a first set of one or more first attributes of the defects. The method also includes selecting, independently from one or more of the bins, defects within the bins based on diversity in a second set of one or more second attributes of the defects. The selected defects are then used to create a defect sample for the wafer. In this manner, defects having diverse values of multiple attributes can be easily selected.