logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9578756 B1

PDFFull Text
Date of Patent:
Feb. 21, 2017

Filed:

Dec. 09, 2014

Printed wiring board and method for manufacturing printed wiring board

Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Hiroyuki Nishioka, Ogaki, JP;

Shinsuke Ishikawa, Ogaki, JP;

Assignee:

IBIDEN Co., Ltd., Ogaki-shi, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Chau N Nguyen

Assistant Examiner:

Roshn Varghese

Int. Cl.
CPC ...
H05K 1/09 (2006.01); C08F 2/46 (2006.01); C08J 7/18 (2006.01); H05H 1/00 (2006.01); H05H 1/24 (2006.01); H05K 3/46 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5383 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81192 (2013.01); H01L 2924/15311 (2013.01); H05K 2203/095 (2013.01);
Abstract

A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. Each of the resin insulation layers includes a modified resin layer formed by plasma treatment such that the modified resin layer is forming the surface of each of the resin insulation layers, each of the conducive layers includes a modified conductive layer formed by the plasma treatment such that the modified conductive layer is forming the surface of each of the conductive layers, and the modified resin layer has a surface modification different from a surface modification of the modified conductive layer.

Find Patent Forward Citations

Quick Actions:

Nishioka, Hiroyuki. (2017). Printed wiring board and method for manufacturing printed wiring board (U.S. Patent No. 9578756). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9578756

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…